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Original High-power semiconductor refrigeration sheet TEC1-12712

TEC1-12712

Model:TEC1-12712

Manufacturer:ANSC/OEM

Size:40*40*4.0mm±0.2 Component log: 127

Assembly pressure:85N/cm2

Working current:Imax=9.5A (Maximum voltage 15.5V 12A at start-up)

Storage conditions:-40~60℃

Packaging process:Surrounding Standard 704 Silicone Rubber Seal

Rated voltage:DC12V(Vmax:15.5V)

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Product Description

 

High-power semiconductor refrigeration sheet TEC1-12712

 

Chip type:TEC1-12712
Size:40*40*3.3mm±0.2  Component log:127
wire:Tin plating on 200±8mm RV standard conductor with 5 mm lead length
Internal resistance:1.0~1.1Ω(ambient temperature 23±1℃, 1kHZ Ac test)
TD MAX:above 60℃
Working current:Imax=9.5A (Maximum voltage 15.5V 12A at start-up)
Rated voltage:DC12V(Vmax:15.5V)
Refrigeration power:114W (excessive heat dissipation surface temperature will reduce cooling power)
Assembly pressure:85N/cm2
Working environment:Temperature range-55℃~83℃(excessive ambient temperature drop directly affects refrigeration efficiency)
Packaging process:Surrounding Standard 704 Silicone Rubber Seal
Packaging standards:Foam box packaging, storage conditions, ambient temperature-10℃~40℃
Storage conditions:-40~60℃
Power requirements:Single voltage 12V, current 12A or more working power supply (can be used in series and parallel)
Device characteristics:Red-wire cathode, black-wire cathode

There is literal for the refrigeration surface, no literal for the heat dissipation surface!
Notes for Device Work:Temperature difference will occur on both sides of the 12 volt power chiller. One side is cold and the other side is hot. Never electrify the cooler for a long time without radiator, otherwise it will cause overheating and burning inside the cooler.

Regular supply Also can be customized


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High-power semiconductor refrigeration sheet TEC1-12715

High-power semiconductor refrigeration sheet TEC1-12715


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