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Product Features

embedded MultiMediaCard Ver. 5.0 compatible. Detail description is referenced by JEDEC Standard
SAMSUNG e·MMC supports features of eMMC5.0 which are defined in JEDEC Standard

- Supported Features : Packed command, Cache, Discard, Sanitize, Power Off Notification, Data Tag,

Partition types, Context ID, Real Time Clock, Dynamic Device Capacity, HS200

- Non-supported Features : Large Sector Size (4KB)

Full backward compatibility with previous MultiMediaCard system specification (1bit data bus, multi-e·MMC systems)
Data bus width : 1bit (Default), 4bit and 8bit
MMC I/F Clock Frequency : 0 ~ 200MHz

MMC I/F Boot Frequency : 0 ~ 52MHz

Temperature : Operation (-25?C ~ 85?C), Storage without operation (-40?C ~ 85?C)
Power : Interface power → VDD(VCCQ) (1.70V ~ 1.95V or 2.7V ~ 3.6V) , Memory power → VDDF(VCC) (2.7V ~ 3.6V)

Attribute	Attribute value
Model	ANSC-M24082073
Product Name	KLMAG2GEND-B031
ECCN (US)	3A991.b.1.a
Part Status	Obsolete
Automotive	No
PPAP	No
Cell Type	MLC NAND
Chip Density (bit)	128G
Architecture	Sectored
Boot Block	Yes
Number of Bits/Word (bit)	36989
Number of Words	128G/32G/16G
Programmability	Yes
Timing Type	Synchronous
Maximum Erase Time (S)	0.02
Interface Type	Serial e-MMC
Minimum Operating Supply Voltage (V)	2.7
Maximum Operating Frequency (MHz)	200
Typical Operating Supply Voltage (V)	3\|3.3
Maximum Operating Supply Voltage (V)	3.6
Minimum Operating Temperature (°C)	-25
Maximum Operating Temperature (°C)	85
Command Compatible	Yes
ECC Support	Yes
Support of Page Mode	No
Packaging	Tape and Reel\|Tray
Mounting	Surface Mount
Package Height	0.48
Package Width	11.5
Package Length	13
PCB changed	153
Standard Package Name	BGA
Supplier Package	FBGA
Pin Count	153
Lead Shape	Ball

KLMAG2GEND-B031 3

KLMAG2GEND-B031 4

KLMAG2GEND-B031 2

KLMAG2GEND-B031

KLMAG2GEND-B031 5

詳情8.1

詳情頁3.1

詳情5.1

詳情6.1

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