Product Details
| GENERAL DESCRIPTION The 256Mb SDRAM is a high-speed CMOS, dynamic random-access memory containing 268,435,456 bits. It is internally configured as a quad bank DRAM with a synchronous interface (all signals are registered on the positive edge of the clock signal, CLK). Each of the x4’s 67,108,864-bit banks is orga nized as 8,192 rows by 2,048 columns by 4 bits. Each of the x8’s 67,108,864-bit banks is orga nized as 8,192 rows by 1,024 columns by 8 bits. Each of the x16’s 67,108,864-bit banks is organized as 8,192 rows by 512 columns by 16 bits. FEATURES ? PC66-, PC100-, and PC133-compliant ? Fully synchronous; all signals registered on positive edge of system clock ? Internal pipelined operation; column address can be changed every clock cycle ? Internal banks for hiding row access/precharge ? Programmable burst lengths: 1, 2, 4, 8, or full page ? Auto Precharge, includes CONCURRENT AUTO PRECHARGE, and Auto Refresh Modes ? Self Refresh Mode ? 64ms, 8,192-cycle refresh ? LVTTL-compatible inputs and outputs ? Single +3.3V ±0.3V power supply |
Product Description
| Type# | Description |
| ANSC PART# | ANSC - MT48LC16M16A2TG-75IT |
| Manufacturer | MICRON |
| Part Package Code | TSOP2 |
| Package Description | TSOP2, TSOP54,.46,32 |
| Pin Count | 54 |
| Samacsys Manufacturer | Micron |
| Access Mode | FOUR BANK PAGE BURST |
| Access Time-Max | 5.4 ns |
| Additional Feature | AUTO/SELF REFRESH |
| Clock Frequency-Max (fCLK) | 133 MHz |
| I/O Type | COMMON |
| Interleaved Burst Length | 1,2,4,8 |
| Length | 22.22 mm |
| Memory Density | 268435460 bit |
| Memory IC Type | SYNCHRONOUS DRAM |
| Memory Width | 16 |
| Moisture Sensitivity Level | 3 |
| Number of Functions | 1 |
| Number of Ports | 1 |
| Number of Terminals | 54 |
| Number of Words | 16777216 words |
| Number of Words Code | 16000000 |
| Operating Mode | SYNCHRONOUS |
| Operating Temperature-Max | 85 °C |
| Operating Temperature-Min | -40 °C |
| Organization | 16MX16 |
| Output Characteristics | 3-STATE |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | TSOP2 |
| Package Equivalence Code | TSOP54,.46,32 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, THIN PROFILE |
| Peak Reflow Temperature (Cel) | 235 |
| Qualification Status | Not Qualified |
| Refresh Cycles | 8192 |
| Seated Height-Max | 1.2 mm |
| Self Refresh | YES |
| Sequential Burst Length | 1,2,4,8,FP |
| Standby Current-Max | 0.002 A |
| Supply Current-Max | 0.125 mA |
| Supply Voltage-Max (Vsup) | 3.6 V |
| Supply Voltage-Min (Vsup) | 3 V |
| Supply Voltage-Nom (Vsup) | 3.3 V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.8 mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Width | 10.16 mm |
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